Semiconductor device

Details Semiconductor device Semiconductor device

2007-11-13

2007-11-13

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S666000, C257S669000, C257SE23051

Reexamination Certificate

active

11196355

ABSTRACT:
A semiconductor device is composed of a heat sink, an IC chip mounted and fixed on a specific face of the heat sink, a lead frame electrically connected to the IC chip and a sealing mold resin package. One or more of the faces of the heat sink has a specific surface area.

REFERENCES:
patent: 6197615 (2001-03-01), Song et al.
patent: 7148564 (2006-12-01), Mock et al.
patent: A-63-66953 (1988-03-01), None
patent: A-10-313081 (1998-11-01), None
patent: 1019970010673 (1997-06-01), None
Notice of Final Rejection from Korean Patent Office issued on Nov. 23, 2006 for the corresponding Korean patent application No. 10-2005-0071981 (a copy and English translation thereof).
Notice of Preliminary Rejection from Korean Patent Office issued on Aug. 22, 2006 for the corresponding Korean patent application No. 10-2005-0071981 (a copy and English translation thereof).

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3846695