Method and system for hermetically sealing packages for optics

Details Method and system for hermetically sealing packages for optics Method and system for hermetically sealing packages for optics

2007-12-04

2007-12-04

Crispino, Richard (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S300000

Reexamination Certificate

active

10693323

ABSTRACT:
A method for hermetically sealing devices. The method includes providing a substrate which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The method also provides a transparent member of a predetermined thickness which includes a plurality of recessed regions arranged in a spatial manner as a second array and a standoff region. The method also includes aligning the transparent member in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. The method further includes hermetically sealing each of the chips within one of the respective recessed regions by using at least a bonding process to isolate each of the chips within one of the recessed regions.

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