Method for manufacturing semiconductor device, adhesive...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

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C438S114000

Reexamination Certificate

active

11032290

ABSTRACT:
A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

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Japanese Patent Office Action issued on the corresponding Japanese Patent Application No. 2002-217680, dated May 16, 2006.
Chinese Patent Office Action issued on the corresponding Chinese Patent Application No. 031784593, issued on Sep. 8, 2006.

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