Press-fit sealed electronic component and method for...

Details Press-fit sealed electronic component and method for... Press-fit sealed electronic component and method for...

2007-10-02

2007-10-02

Patel, Dhiru R. (Department: 2831)

Electricity: conductors and insulators

Insulators

With conductor receiving aperture or bushing type

C174S154000, C174S157000, C174S168000

Reexamination Certificate

active

10968842

ABSTRACT:
A press-fit sealed electronic component includes an electronic component, a plug to be equipped with the electronic component, and a tube to be sealed by press-fitting the plug, wherein the plug is brought into close contact with the tube through a tin-free alloy layer. A method for producing a press-fit sealed electronic component includes the steps of forming the plug and the tube with a nickel silver material, forming a tin-copper layer by plating on each surface of the plug and the tube, forming a copper-zinc alloy layer at the interface between the nickel silver material and the tin-copper layer by heat treatment, removing the tin-copper layer remaining on the copper-zinc alloy layer to expose the copper-zinc alloy layer, and bringing the plug into close contact with the tube through the exposed copper-zinc alloy layer to seal the tube by press-fit.

REFERENCES:
patent: 4296458 (1981-10-01), Smith et al.
patent: 6769936 (2004-08-01), Gutierrez et al.
patent: 2586981 (1996-12-01), None
patent: 09-260990 (1997-10-01), None
patent: 10-150115 (1998-06-01), None
patent: 2003-133460 (2003-05-01), None
patent: 2003-142614 (2003-05-01), None
Communication from Japanese Patent Office re: related application.

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