Method and apparatus for inspecting an edge exposure area of...

Details Method and apparatus for inspecting an edge exposure area of... Method and apparatus for inspecting an edge exposure area of...

2007-10-09

2007-10-09

Toatley, Jr., Gregory J. (Department: 2877)

Optics: measuring and testing

Dimension

Width or diameter

C356S445000, C356S614000, C356S630000

Reexamination Certificate

active

10787765

ABSTRACT:
For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.

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patent: 10-2003-0006828 (2003-01-01), None
patent: 10-2003-0010047 (2003-02-01), None

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