Apparatus for stacking electrical components using insulated...

Details Apparatus for stacking electrical components using insulated... Apparatus for stacking electrical components using insulated...

2007-05-15

2007-05-15

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23011, C257SE23021, C257SE23024, C257SE23101, C257SE25013, C257S686000, C257S777000, C257S691000, C257S693000, C257S723000, C257S673000, C257S774000, C257S680000, C257S528000, C257S532000, C257S775000, C257S776000, C257S784000, C257S786000

Reexamination Certificate

active

11030484

ABSTRACT:
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

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