Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-06-19
2007-06-19
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S724000, C257S924000, C257S704000, C257S710000, C257S706000, C257S707000, C257S722000, C257SE23051, C257SE31131
Reexamination Certificate
active
11064822
ABSTRACT:
A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.
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Baba Shinji
Watanabe Masaki
Clark Jasmine
Renesas Technology Corp.
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