Method for forming stencil

Details Method for forming stencil Method for forming stencil

2007-05-08

2007-05-08

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C029S846000, C029S832000, C029S874000, C257S782000, C257S783000, C228S180220

Reexamination Certificate

active

10689471

ABSTRACT:
A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the segmental annular openings define spokes extending from a central portion of said stencil connected via those spokes to the rest of the stencil plate. The spokes extend past two adjacent annular segments.

REFERENCES:
patent: 4135020 (1979-01-01), Maxwell
patent: 4490217 (1984-12-01), Culp et al.
patent: 5245932 (1993-09-01), Ujiie
patent: 5392980 (1995-02-01), Swamy et al.
patent: 5414223 (1995-05-01), Suski et al.
patent: 5460316 (1995-10-01), Hefele
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5585162 (1996-12-01), Schueller
patent: 5872399 (1999-02-01), Lee
patent: 5978230 (1999-11-01), Dando et al.
patent: 6077000 (2000-06-01), Gibbons et al.
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6316289 (2001-11-01), Chung
patent: 6329605 (2001-12-01), Beroz et al.
patent: 6659328 (2003-12-01), Dances
patent: 6762503 (2004-07-01), Lee
patent: 6959328 (2005-10-01), Gillaspy et al.
patent: 2031340 (1980-04-01), None

Affiliated with

Also associated with

Rating

Method for forming stencil does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming stencil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming stencil will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3817057