4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Edward A. Schrock

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Adhesive composition and methods for use in packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Adhesive composition for use in packaging applications

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate

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Controlling packaging encapsulant leakage

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Controlling packaging encapsulant leakage

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Controlling packaging encapsulant leakage

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Profile ID: LFUS-PAI-P-211198

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