Electronic component having at least one semiconductor chip...

Details Electronic component having at least one semiconductor chip... Electronic component having at least one semiconductor chip...

2007-02-13

2007-02-13

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S778000, C257SE21575, C438S584000, C438S614000, C438S617000, C438S524000, C438S666000

Reexamination Certificate

active

10960994

ABSTRACT:
An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged. The rewiring plate has a wiring support made of polycrystalline silicon, amorphous glass, or metal. Furthermore, the present invention relates to a method for the production of a suitable wiring support and of the electronic component.

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