Apparatuses and associated methods for improved solder joint...

Details Apparatuses and associated methods for improved solder joint... Apparatuses and associated methods for improved solder joint...

2007-07-10

2007-07-10

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000, C257SE23060

Reexamination Certificate

active

11139223

ABSTRACT:
Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.

REFERENCES:
patent: 5490040 (1996-02-01), Gaudenzi et al.
patent: 5715595 (1998-02-01), Kman et al.
patent: 7017795 (2006-03-01), Liu et al.
patent: 2001/0015491 (2001-08-01), Shiraishi
patent: 2001/0032388 (2001-10-01), Morris
patent: 2002/0016093 (2002-02-01), Nakamura
patent: 2002/0081774 (2002-06-01), Liang et al.
patent: 2003/0001254 (2003-01-01), Jackson et al.
Cheng Siew Tay, et al., Behavior of Package With Integrated Heat Spreader, Pan Pacific Symposium, Feb. 10, 2004, Surface Mount Technology Association, Intel Products (Malaysia).

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