Micromechanical device with thinned cantilever structure and...

Details Micromechanical device with thinned cantilever structure and... Micromechanical device with thinned cantilever structure and...

2007-05-29

2007-05-29

Chapman, John E. (Department: 2856)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C073S514330, C073S514360

Reexamination Certificate

active

11322852

ABSTRACT:
In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer with a thinned flexure structure. In another embodiment, the device and method of producing the device includes an accelerometer and a pressure sensor integrated on a single chip.

REFERENCES:
patent: 4882933 (1989-11-01), Petersen et al.
patent: 5121633 (1992-06-01), Murakami et al.
patent: 5279162 (1994-01-01), Takebe et al.
patent: 5659138 (1997-08-01), Iwata et al.
patent: 6084257 (2000-07-01), Petersen et al.
patent: 6912759 (2005-07-01), Izadnegahdar et al.
Petersen et al. (1991), “Surface Micromachined Structures Fabricated with Silicon Fusion Bonding,” IEEE, pp. 397-399.

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