Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-09-11
2007-09-11
Prenty, Mark V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000
Reexamination Certificate
active
11160997
ABSTRACT:
A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
REFERENCES:
patent: 5106784 (1992-04-01), Bednarz
patent: 5227663 (1993-07-01), Patil et al.
patent: 5455456 (1995-10-01), Newman
patent: 5706171 (1998-01-01), Edwards et al.
patent: 5891755 (1999-04-01), Edwards et al.
patent: 5909056 (1999-06-01), Mertol
patent: 5950074 (1999-09-01), Glenn et al.
patent: 6117705 (2000-09-01), Glenn et al.
patent: 6218730 (2001-04-01), Toy et al.
patent: 6268654 (2001-07-01), Glenn et al.
patent: 6794749 (2004-09-01), Akram
patent: 2007/0045819 (2007-03-01), Edwards et al.
Edwards David L.
Iruvanti Sushumna
Toy Hilton T.
Zou Wei
Gibb & Rahman, LLC
Petrokaitis, Esq. Joseph
Prenty Mark V.
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