Package stress management

Details Package stress management Package stress management

2007-01-30

2007-01-30

Baumeister, B. William (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S789000, C257S790000, C257S778000, C257S738000, C257SE23119, C257SE23126

Reexamination Certificate

active

10882783

ABSTRACT:
Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

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