Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2007-03-27
2007-03-27
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C216S013000, C216S017000, C216S039000, C438S048000, C347S001000
Reexamination Certificate
active
10861289
ABSTRACT:
A method for producing a system with a substrate with a surface and a component applied to a predetermined location of the surface of the substrate includes a step of generating a liquid volume containing the component and a step of applying the liquid volume containing the component on the surface of the substrate. At that, the liquid volume is sized so that it wets only a partial area of the surface of the substrate after its application. In the step of applying the liquid volume is placed on the surface of the substrate so that the partial area of the surface includes the predetermined location. The component or the predetermined location of the surface of the substrate is implemented so that after the application of the liquid volume a force acts on the component which is sufficient to drive the component within the liquid volume to the predetermined location. The method is completely independent of the speed of a gripper and its capability to grip and align a very small component.
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Alanko Anita
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung
Glenn Michael A.
Glenn Patent Group
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