Positive photoresist composition and pattern making method...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S907000

Reexamination Certificate

active

10921962

ABSTRACT:
A positive photoresist composition containing: (A) a resin which contains at least one of a repeating unit represented by the formula (IA) defiend herein and a repeating unit represented by the formula (IB) defined herein, and is decomposed by an action of an acid and shows an increase in a solubility in an alkali developer; and (B) as compounds capable of generating an acid upon irradiation with one of an actinic ray and a radiation, at least two compounds selected from the compounds (B1), (B2), (B3) and (B4) as defiend herein.

REFERENCES:
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Toriumi M. et al, “Novel Main-chain-fluorinated Polymers for 157-nm Photoresists”, Proceedings of the SPIE, vol. 5039, Jun. 2003, pp. 53-60.

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