Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-09-18
2007-09-18
Doan, Theresa (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C438S123000
Reexamination Certificate
active
11443540
ABSTRACT:
A device for electrically interconnecting one or more semiconductor devices to provide for flexibility in wiring and preventing long or shorted leads and methods for fabricating and using same. The device has a substrate with a plurality of substantially concentric electrically-conductive paths, each of the plurality of electrically-conductive paths being electrically isolated from each other and formed on a first surface of the substrate. At least one of the plurality of electrically-conductive paths is arranged concentrically so as to substantially span a width of the first surface of the substrate. A plurality of bonding pads is electrically coupled to each of the electrically-conductive paths. The plurality of bonding pads is coupled to one of the electrically-conductive paths and is electrically isolated from bonding pads located on any other electrically-conductive path. The entire interconnect device may be mounted in a standard leadframe product.
REFERENCES:
patent: 5371390 (1994-12-01), Mohsen
patent: 5504354 (1996-04-01), Mohsen
patent: 5654564 (1997-08-01), Mohsen
patent: 5973340 (1999-10-01), Mohsen
patent: 6048753 (2000-04-01), Farnworth et al.
patent: 6160276 (2000-12-01), Mohsen
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6249047 (2001-06-01), Corisis
patent: 6376914 (2002-04-01), Kovats et al.
patent: 6384476 (2002-05-01), Takeuchi
patent: 6511901 (2003-01-01), Lam et al.
patent: 6593649 (2003-07-01), Lin et al.
patent: 6747349 (2004-06-01), Al-Dabagh et al.
patent: 6750546 (2004-06-01), Villanueva et al.
patent: 6770963 (2004-08-01), Wu
patent: 6798056 (2004-09-01), Matsuura et al.
patent: 6812557 (2004-11-01), Matsuo et al.
patent: 7078792 (2006-07-01), Lam et al.
patent: 2002/0027280 (2002-03-01), Corisis et al.
patent: 2002/0163019 (2002-11-01), Mohsen
patent: 2003/0006498 (2003-01-01), Hirayama
patent: 2005/0173793 (2005-08-01), Rohrmoser et al.
Kovats Julius A.
Lam Ken M.
Atmel Corporation
Doan Theresa
Schneck Thomas
Schneck & Schneck
LandOfFree
Universal interconnect die does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Universal interconnect die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal interconnect die will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3772471