Electronic component having an integrated passive electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S307000, C257S308000, C257S309000, C257S310000

Reexamination Certificate

active

11109405

ABSTRACT:
An electronic component and method of production thereof is presented. The electronic component includes a first insulation layer, an upper metal layer on the first insulation layer, an electrically conductive structure integrated into the first insulation layer and formed as a capacitor with a first metal strip sequence, and a second metal strip sequence. Each of the first and second sequences are arranged congruently one above another and are connected to one another by via connections. The second sequence is arranged on both sides of the first sequence at identical lateral distances. The metal strips of the first and second sequences are arranged at the same level and are connected to different electrical potentials. The electrically conductive structure mechanically stabilizes the insulation layer under the action of mechanical force such as bonding of the upper metal layer or mounting of the electronic component.

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Roberto Aparicio, “Capacity Limits and Matching Properties of Integrated Capacitors” pp. 384-393, IEEE Journal of Solid-State Circuits, vol. 37, No. 3, Mar. 2002.
International Examination Report from corresponding PCT patent application No. PCT/DE03/02987.
International Search Report from corresponding PCT patent application No. PCT/DE03/02987.

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