Method and system for flattening a reticle within a...

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Reexamination Certificate

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C361S233000

Reexamination Certificate

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10755731

ABSTRACT:
For clamping a reticle within a lithography system, a first area in the center of the reticle is clamped to a chuck of the lithography system at a first time point. In addition, a second area toward an outer perimeter of the reticle is clamped to the chuck at a second time point after the first time point such that the reticle is flattened against the chuck. With such flattening of the reticle, image placement error on a semiconductor substrate is minimized.

REFERENCES:
patent: 4520421 (1985-05-01), Sakitani et al.
patent: 4692836 (1987-09-01), Suzuki
patent: 5880923 (1999-03-01), Hausmann
patent: 6538873 (2003-03-01), Larsen
patent: 2002/0006556 (2002-01-01), Gianoulakis et al.
patent: 2003/0067734 (2003-04-01), Nakano

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