Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2007-01-30
2007-01-30
Lee, Eddie C. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S786000, C257S780000, C257S781000, C257S737000, C257S736000, C257S738000, C257S739000, C257S734000, C257S690000, C257S773000
Reexamination Certificate
active
10711185
ABSTRACT:
Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
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Bernier William E.
Cole Marie S.
Farooq Mukta G.
Knickerbocker John U.
Lopez Tasha E.
Cioffi, Esq. James C.
Gibb I.P. Law Firm LLC
Im Junghwa
Lee Eddie C.
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