Redistribution layer with microstrips

Details Redistribution layer with microstrips Redistribution layer with microstrips

2007-09-25

2007-09-25

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S652000

Reexamination Certificate

active

11137783

ABSTRACT:
A semiconductor device includes a completed semiconductor chip and a dielectric layer overlying the completed semiconductor chip. A redistribution layer overlies the completed semiconductor chip and is embedded in the dielectric layer. The redistribution layer includes a plurality of microstrip conductors. Each microstrip conductor has a height and a width selected such that the height is at least twice the width. In addition, each microstrip conductor is separated from an adjacent microstrip conductor by a spacing distance that is at least twice the width.

REFERENCES:
patent: 6737345 (2004-05-01), Lin et al.
patent: 2006/0046350 (2006-03-01), Jiang et al.

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