Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2007-04-17
2007-04-17
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257SE23079, C257S773000, C257S781000, C438S108000, C438S113000
Reexamination Certificate
active
10662382
ABSTRACT:
A semiconductor device has peripheral electrode pads formed on the periphery of a semiconductor chip, land pads comprising the first land pads and the second land pads formed on the semiconductor chip, and circuits formed in the semiconductor chip. The peripheral electrode pads are connected to internal circuits by internal lines. The first land pads are connected to the peripheral electrode pads by rewired lines. The second electrode pads, on the other hand, are connected to the internal circuits by internal electrode pads and internal lines, not by the peripheral electrode pads.
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Kanai Tomonori
Kikuchi Yuji
Kishimoto Kiyoharu
Chu Chris C.
Hitachi Maxell Ltd.
Parker Kenneth
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