Contacting device, testing method and corresponding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S734000, C257S737000, C257S739000, C257S773000, C257S776000, C257SE23021

Reexamination Certificate

active

11374391

ABSTRACT:
A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first terminal regions to an upper side of the elastic elevation. The plurality of first terminal regions is configured so that signals of a tester device can be fed to the plurality of first terminal regions, the interconnects have first contact regions located at the upper side of the elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit, and the first contact regions comprise first particles for roughening the surface of the first contact regions.

REFERENCES:
patent: 5487999 (1996-01-01), Farnworth
patent: 5716218 (1998-02-01), Farnworth et al.
patent: 5876580 (1999-03-01), Lykins, II
patent: 6133066 (2000-10-01), Murakami
patent: 2002/0053735 (2002-05-01), Neuhaus et al.
patent: 2003/0067755 (2003-04-01), Haimerl et al.
patent: 2003/0218252 (2003-11-01), Suzuki et al.
patent: 2004/0140571 (2004-07-01), Tomura et al.
patent: 2004/0174176 (2004-09-01), Kirby
patent: 10324450 (2005-01-01), None
patent: 69533336 (2005-01-01), None
patent: 10353676 (2005-06-01), None
German Office Action dated Aug. 26, 2005.

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