Lead frame for integrated circuit

Details Lead frame for integrated circuit Lead frame for integrated circuit

1988-01-13

1989-09-19

Hille, Rolf

357 68, H01L 2348

Patent

active

048686352

ABSTRACT:
An integrated circuit lead frame is configured so that it may be die stamped to cut lead frame leads to customize it for a particular semiconductor device bar size. Lead frame leads are cut at a specified distance from the lead frame bar pad so that a semiconductor device bar which is larger than the bar pad may be mounted on the bar pad and cut segments of lead frame leads that are attached to the bar pad.

REFERENCES:
patent: 4026008 (1977-05-01), Drees et al.
patent: 4137546 (1979-01-01), Frusco
patent: 4410906 (1983-10-01), Grabbe
patent: 4554404 (1985-11-01), Gilder, Jr. et al.
patent: 4611398 (1986-09-01), Eames et al.

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