System for substrate processing with meniscus, vacuum, IPA...

Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S099100, C134S902000, C034S407000

Reexamination Certificate

active

10330897

ABSTRACT:
One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate.

REFERENCES:
patent: 3953265 (1976-04-01), Hood
patent: 4086870 (1978-05-01), Canavello et al.
patent: 4444492 (1984-04-01), Lee
patent: 4838289 (1989-06-01), Kottman et al.
patent: 5102494 (1992-04-01), Harvey et al.
patent: 5180431 (1993-01-01), Sugimoto et al.
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5294257 (1994-03-01), Kelly et al.
patent: 5343234 (1994-08-01), Kuehnle
patent: 5361449 (1994-11-01), Akimoto
patent: 5472502 (1995-12-01), Batchelder
patent: 5558111 (1996-09-01), Lofaro
patent: 5601655 (1997-02-01), Bok et al.
patent: 5660642 (1997-08-01), Britten
patent: 5705223 (1998-01-01), Bunkofske
patent: 5709757 (1998-01-01), Hatano et al.
patent: 5807522 (1998-09-01), Brown et al.
patent: 5830334 (1998-11-01), Kobayashi
patent: 5882433 (1999-03-01), Ueno
patent: 5893004 (1999-04-01), Yamamura
patent: 5945351 (1999-08-01), Mathuni
patent: 5975098 (1999-11-01), Yoshitani et al.
patent: 5989478 (1999-11-01), Ouellette et al.
patent: 5997653 (1999-12-01), Yamasaka
patent: 6086454 (2000-07-01), Watanabe et al.
patent: 6092937 (2000-07-01), Snodgrass et al.
patent: 6132586 (2000-10-01), Adams et al.
patent: 6214513 (2001-04-01), Cai et al.
patent: 6230722 (2001-05-01), Mitsumori et al.
patent: 6341998 (2002-01-01), Zhang
patent: 6391166 (2002-05-01), Wang
patent: 6398975 (2002-06-01), Mertens et al.
patent: 6417117 (2002-07-01), Davis
patent: 6446358 (2002-09-01), Mitsumori et al.
patent: 6474786 (2002-11-01), Percin et al.
patent: 6488040 (2002-12-01), de Larios et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6514570 (2003-02-01), Matsuyama et al.
patent: 6530823 (2003-03-01), Ahmadi et al.
patent: 6531206 (2003-03-01), Johnston et al.
patent: 6555017 (2003-04-01), Rushford et al.
patent: 6616772 (2003-09-01), de Larios et al.
patent: 6629540 (2003-10-01), Mitsumori et al.
patent: 6851435 (2005-02-01), Mertens et al.
patent: 6954993 (2005-10-01), Smith et al.
patent: 6988326 (2006-01-01), O'Donnell et al.
patent: 2002/0007869 (2002-01-01), Pui et al.
patent: 2002/0020622 (2002-02-01), Hanson et al.
patent: 2002/0051644 (2002-05-01), Sugimoto et al.
patent: 2002/0121290 (2002-09-01), Tang et al.
patent: 2002/0125212 (2002-09-01), Mertens et al.
patent: 2003/0091745 (2003-05-01), Yogev et al.
patent: 2003/0091754 (2003-05-01), Chihani et al.
patent: 2003/0092264 (2003-05-01), Kajita et al.
patent: 2003/0138968 (2003-07-01), Fisher et al.
patent: 2004/0060195 (2004-04-01), Garcia
patent: 2004/0060573 (2004-04-01), Woods
patent: 2004/0060580 (2004-04-01), Woods
patent: 2004/0060581 (2004-04-01), Garcia et al.
patent: 2004/0069319 (2004-04-01), Boyd et al.
patent: 2004/0069326 (2004-04-01), Woods et al.
patent: 2004/0069329 (2004-04-01), De Larios et al.
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0178060 (2004-09-01), Ravkin et al.
patent: 2004/0182422 (2004-09-01), Boyd et al.
patent: 2005/0132515 (2005-06-01), Boyd et al.
patent: 2005/0139318 (2005-06-01), Woods et al.
patent: 2005/0145265 (2005-07-01), Ravkin et al.
patent: 2005/0145267 (2005-07-01), Korolik et al.
patent: 2005/0145268 (2005-07-01), Woods
patent: 2005/0148197 (2005-07-01), Woods et al.
patent: 2005/0217703 (2005-10-01), O'Donnell
patent: 2006/0064895 (2006-03-01), Garcia et al.
patent: 0 905 746 (1999-03-01), None
patent: 0 905 747 (1999-03-01), None
patent: 1 489 461 (2004-12-01), None
patent: 1 489 462 (2004-12-01), None
patent: 05837190 (1983-03-01), None
patent: 02280330 (1990-11-01), None
patent: 02309638 (1990-12-01), None
patent: 08277486 (1996-10-01), None
patent: 11031672 (1999-02-01), None
patent: 11350169 (1999-12-01), None
patent: 2003-151948 (2003-05-01), None
patent: WO 99/16109 (1999-04-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 02/01613 (2002-01-01), None
patent: WO 02/32825 (2002-04-01), None
patent: WO 02/101795 (2002-12-01), None
patent: WO 03/014416 (2003-02-01), None
patent: WO 2004/030051 (2004-04-01), None
J.A. Britten, “A moving-zone Marangoni drying process for critical cleaning and wet processing,” Oct. 1997,Solid State Technology.
Owa et al. “Immersion lithography; its potential performance and issues”, Proceedings of the SPIE, SPIE, Bellingham, VA, US, vol. 5040, No. 1, Feb. 28, 2003, pp. 724-733, XP002294500.
Lim et al., “Atomic Layer deposition of transition metals”, Department of Chemistry and Chemical Biology, Harvard University, Nature Publishing Group, vol. 2, Nov. 2003, pp. 749-754.
ICKnowledge LLC, “Technology Backgrounder: Atomic Layer Deposition”, ICKnowledge.com, 2004, pp. 1-7.
“Chemical vapor deposition”, Wikipedia, the free encyclopedia, http://en.wikipedia.org/wiki/Chemical—vapor—deposition, 2005, p. 1-2.
Sigma-Aldrich, “Atomic Layer Deposition(ALD)”, http://www.sigmaaldrich.com/Area—of—Interest/Chemistry/Materials—Science/Thin—Films, 2005, p. 1-2.
U.S. Appl. No. 10/834,548, filed Apr. 28, 2004, Hemker et al.
U.S. Appl. No. 11/173,729, filed Jun. 30, 2005, Ravkin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System for substrate processing with meniscus, vacuum, IPA... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for substrate processing with meniscus, vacuum, IPA..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for substrate processing with meniscus, vacuum, IPA... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3725673

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.