MOS semiconductor device

Details MOS semiconductor device MOS semiconductor device

2007-03-20

2007-03-20

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S327000, C257S338000, C257S350000, C257S351000, C257S357000, C257S369000, C257S371000, C257S510000

Reexamination Certificate

active

10498377

ABSTRACT:
While using conventional manufacturing processes, it is intended to apply a compressive strain in the channel direction to the p-channel MOS field effect transistor and also apply a tensile strain in the channel direction to the n-channel MOS field effect transistor for increasing both MOS currents. In the MOS semiconductor device isolated by a trench device isolation regions, the p-channel MOS field effect transistor is designed so that a length of a source/drain region in the channel direction is not more than 1 micrometer, and the gate length is not more than 0.2 micrometers. The n-channel MOS field effect transistor is designed so that a face of the source/drain region in parallel to the gate width direction is adjacent to the device isolation film with the inserted silicon nitride film, and a face of the source/drain region parallel to the gate length direction is adjacent to the device isolation film including the silicon oxide film only.

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International Search Report dated Mar. 25, 2003.

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