Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-04-10
2007-04-10
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S921000, C430S325000, C430S326000, C430S907000, C568S075000
Reexamination Certificate
active
10893345
ABSTRACT:
A stimulus-sensitive composition comprising a compound (A) that generates one of an acid and a radical by external stimulation, the compound (A) having a specific structure.
REFERENCES:
patent: 6093753 (2000-07-01), Takahashi
patent: 2003/0215739 (2003-11-01), Harada et al.
patent: 2004/0185378 (2004-09-01), Kodama et al.
patent: 1 353 225 (2003-10-01), None
patent: 2000-292917 (2000-10-01), None
patent: 2001-187780 (2001-07-01), None
patent: 2001-294570 (2001-10-01), None
patent: 2002-236358 (2002-08-01), None
patent: 2002-255930 (2002-09-01), None
patent: 2002-265512 (2002-09-01), None
JPO English abstract for JP 2002-255930 (AOSO et al), provided by Japan Patent Office.
Machine-assisted English translation of JP 2002-236358 (Kodama et al) provided by JPO.
Machine-asssited English translation of JP 2001-187780 (Iwasa et al) provided by JPO.
Machine-assisted English translation of JP 2002-265512 (Uesugi et al) provided by JPO.
European Search Report dated Nov. 22, 2004.
Fujifilm Corporation
Lee Sin
Sughrue & Mion, PLLC
LandOfFree
Stimulus-sensitive composition, compound and pattern... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stimulus-sensitive composition, compound and pattern..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stimulus-sensitive composition, compound and pattern... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3723507