Sputtering target and method for fabricating the same

Details Sputtering target and method for fabricating the same Sputtering target and method for fabricating the same

2006-12-19

2006-12-19

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192120, C204S192150, C204S298120, C204S298130

Reexamination Certificate

active

07150810

ABSTRACT:
A sputtering target includes a backing plate, a copper target provided on the backing plate, and a protection layer formed of a corrosion-resistant metal on the surface of the copper target The protection layer depresses oxidation of the copper target and the adhesion of particles to a substrate due to the release of a deposited layer on the surface of the shielding plate.

REFERENCES:
patent: 5282943 (1994-02-01), Lannutti et al.
patent: 5287619 (1994-02-01), Smith et al.
patent: 5358615 (1994-10-01), Grant et al.
patent: 5540823 (1996-07-01), Fritsche
patent: 6030514 (2000-02-01), Dunlop et al.
patent: 6562715 (2003-05-01), Chen et al.
patent: 5-98423 (1993-04-01), None

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