Light emitting diode and method for manufacturing the same

Details Light emitting diode and method for manufacturing the same Light emitting diode and method for manufacturing the same

2006-10-10

2006-10-10

Dang, Trung (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257SE33063, C257SE33068

Reexamination Certificate

active

07119375

ABSTRACT:
A light emitting diode (LED) includes a substrate, a first conductive clad layer formed on the substrate, an active layer formed on the first conductive clad layer, a second conductive clad layer formed on the active layer, an alumina (Al2O3) layer formed on the lower surface of the substrate, and an aluminum layer formed on the lower surface of the alumina (Al2O3) layer. The substrate may be removed, and the aluminum layer and the alumina layer are formed directly on the lower surface of the first conductive clad layer.

REFERENCES:
patent: 4643532 (1987-02-01), Kleiman
patent: 5376580 (1994-12-01), Kish et al.
patent: 6287882 (2001-09-01), Chang et al.
patent: 6292243 (2001-09-01), Shingu et al.
patent: 6417478 (2002-07-01), Shiraishi et al.
patent: 6861281 (2005-03-01), Uemura et al.
patent: 2002/0024981 (2002-02-01), Tojo et al.
patent: 2003/0025572 (2003-02-01), Maekawa et al.
patent: 2003/0087463 (2003-05-01), Horng et al.
patent: 6-302857 (1994-10-01), None
patent: 2000-228537 (2000-08-01), None
patent: 2001-332762 (2001-11-01), None

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