Semiconductor device

Details Semiconductor device Semiconductor device

2006-06-06

2006-06-06

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S778000

Reexamination Certificate

active

07057278

ABSTRACT:
In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

REFERENCES:
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patent: 6462427 (2002-10-01), Sakiyama et al.
patent: 6501174 (2002-12-01), Semkow et al.
patent: 11-220077 (1999-08-01), None
patent: 2000-040775 (2000-02-01), None
patent: 2000-236042 (2000-08-01), None
Lau et al. “TMA, DMA, DSC, and TGA of lead free solders,” proceedings of the IEEE 48th Electronic Components and Technology Conference, pp. 1339-1344 (May 1998).

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