Methods and apparatuses for drying wafer

Details Methods and apparatuses for drying wafer Methods and apparatuses for drying wafer

2006-02-21

2006-02-21

El-Arini, Zeinab (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

C134S068000, C134S12200P, C134S148000, C134S153000, C134S184000, C134S902000

Reexamination Certificate

active

07000621

ABSTRACT:
Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

REFERENCES:
patent: 6007675 (1999-12-01), Toshima
patent: 6641678 (2003-11-01), DeYoung et al.
patent: 6748960 (2004-06-01), Biberger et al.
patent: 2003/0045131 (2003-03-01), Verbeke et al.
patent: 2004/0248329 (2004-12-01), Satake et al.
Bok, E., et al., “Supercritical Fluids For Single Wafer Cleaning,” Solid State Technology, Technology Topics, Jun. 1992, pp. 117-120.

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