Modules having a plurality of contacts along edges thereof...

Details Modules having a plurality of contacts along edges thereof... Modules having a plurality of contacts along edges thereof...

2006-02-28

2006-02-28

Gushi, Ross (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Reexamination Certificate

active

07004759

ABSTRACT:
The present invention provides a module comprising a circuit board, a plurality of first contacts adjacent to an edge of the circuit board configured to conduct a plurality of signals to the module and a plurality of second contacts adjacent to the edge of the circuit board configured to receive the plurality of signals from the module to outside the module. Memory modules, sockets, circuit boards, and systems are also provided.

REFERENCES:
patent: 6234807 (2001-05-01), Amini et al.
patent: 6379193 (2002-04-01), Fujii et al.
patent: 6414868 (2002-07-01), Wong et al.
patent: 6767252 (2004-07-01), McGrath et al.
patent: 6819625 (2004-11-01), Ruckerbauer et al.
patent: 20-0266904 (2002-02-01), None
Notice to Submit Response (with English language translation), Korean App. 10-2003-0023736, May 30, 2005.

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