Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-06-06
2006-06-06
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S704000
Reexamination Certificate
active
07057276
ABSTRACT:
A semiconductor package with a heat sink is provided. At least one chip and a heat sink attached to the chip are mounted on a substrate. At least one slot is formed through at least one corner of the heat sink at a position attached to the substrate. An adhesive material is applied between the heat sink and substrate and over filled in the slot with an overflow of the adhesive material out of the slot. The adhesive material over filled in the slot provides an anchoring effect and increases its contact area with the heat sink to thereby firmly secure the heat sink on the substrate. Further, the slot formed at the corner of the heat sink can alleviate thermal stresses accumulated at the corner of the heat sink and thereby prevent delamination between the heat sink and the substrate.
REFERENCES:
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5637920 (1997-06-01), Loo
patent: 5889323 (1999-03-01), Tachibana
patent: 5907474 (1999-05-01), Dolbear
patent: 5956576 (1999-09-01), Toy et al.
patent: 6008536 (1999-12-01), Mertol
patent: 6188578 (2001-02-01), Lin et al.
patent: 6218730 (2001-04-01), Toy et al.
patent: 6376907 (2002-04-01), Takano et al.
patent: 6534860 (2003-03-01), Turner
patent: 6538320 (2003-03-01), Tosaya et al.
“Challenges in High Yield, Fine Pitch Solder Ball Attachment”, by Ivy Qin, et al., SEMI—Semicon Singapore—Semiconductor Packaging Conference, pp. 1-10, May, 2001.
Huang Chien-Ping
Lin Chang-Fu
Pu Han-Ping
Clark S. V.
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Siliconware Precision Industries Co. Ltd.
LandOfFree
Semiconductor package with heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package with heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3683177