Transistor with doped gate dielectric

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S406000, C257S410000, C257S411000, C257S412000

Reexamination Certificate

active

07002224

ABSTRACT:
A transistor and method of manufacture thereof. A semiconductor workpiece is doped before depositing a gate dielectric material. Using a separate anneal process or during subsequent anneal processes used to manufacture the transistor, dopant species from the doped region of the workpiece are outdiffused into the gate dielectric, creating a doped gate dielectric. The dopant species fill vacancies in the atomic structure of the gate dielectric, resulting in a transistor having increased speed, reduced power consumption, and improved voltage stability.

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Inumiya, S., et al., “Fabrication of HfSiON Gate Dielectrics by Plasma Oxidation and Nitridation, Optimized for 65nm node Low Power CMOS Applications,” 2003 Symposium on VLSI Technology Digest of Technical Papers, pp. 18-19, Document No. 4-89114-035-6/03.
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