Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-03
2006-10-03
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S652000, C438S653000, C438S654000, C438S658000, C438S686000, C438S666000, C438S675000, C257SE21176, C257SE21190, C257SE21209
Reexamination Certificate
active
07115504
ABSTRACT:
An electrode structure includes a first layer of conductive material and a dielectric layer formed on a surface of the first layer. An opening is formed in the dielectric layer to expose a portion of the surface of the first layer. A binding layer is formed on the dielectric layer and on the exposed portion of the surface of the first layer and a second layer of conductive material is formed on the conductive binding layer. The binding layer can be an oxide and the second layer a conductive material that is diffusible into an oxide. The electrode structure can be annealed to cause conductive material from the second layer to be chemisorbed into the binding layer to improve adhesion between the first and second layers. A programmable cell can be formed by forming a doped glass layer in the electrode structure.
REFERENCES:
patent: 3271591 (1966-09-01), Ovshinsky
patent: 3622319 (1971-11-01), Sharp
patent: 3743847 (1973-07-01), Boland
patent: 3961314 (1976-06-01), Klose et al.
patent: 3966317 (1976-06-01), Wacks et al.
patent: 3983542 (1976-09-01), Ovshinsky
patent: 3988720 (1976-10-01), Ovshinsky
patent: 4177474 (1979-12-01), Ovshinsky
patent: 4267261 (1981-05-01), Hallman et al.
patent: 4269935 (1981-05-01), Masters et al.
patent: 4312938 (1982-01-01), Drexler et al.
patent: 4316946 (1982-02-01), Masters et al.
patent: 4320191 (1982-03-01), Yoshikawa et al.
patent: 4405710 (1983-09-01), Balasubramanyam et al.
patent: 4419421 (1983-12-01), Wichelhaus et al.
patent: 4499557 (1985-02-01), Holmberg et al.
patent: 4597162 (1986-07-01), Johnson et al.
patent: 4608296 (1986-08-01), Keem et al.
patent: 4637895 (1987-01-01), Ovshinsky et al.
patent: 4646266 (1987-02-01), Ovshinsky et al.
patent: 4664939 (1987-05-01), Ovshinsky
patent: 4668968 (1987-05-01), Ovshinsky et al.
patent: 4670763 (1987-06-01), Ovshinsky et al.
patent: 4671618 (1987-06-01), Wu et al.
patent: 4673957 (1987-06-01), Ovshinsky et al.
patent: 4678679 (1987-07-01), Ovshinsky
patent: 4696758 (1987-09-01), Ovshinsky et al.
patent: 4698234 (1987-10-01), Ovshinsky et al.
patent: 4710899 (1987-12-01), Young et al.
patent: 4728406 (1988-03-01), Banerjee et al.
patent: 4737379 (1988-04-01), Hudgens et al.
patent: 4766471 (1988-08-01), Ovshinsky et al.
patent: 4769338 (1988-09-01), Ovshinsky et al.
patent: 4775425 (1988-10-01), Guha et al.
patent: 4788594 (1988-11-01), Ovshinsky et al.
patent: 4795657 (1989-01-01), Formigoni et al.
patent: 4800526 (1989-01-01), Lewis
patent: 4809044 (1989-02-01), Pryor et al.
patent: 4818717 (1989-04-01), Johnson et al.
patent: 4843443 (1989-06-01), Ovshinsky et al.
patent: 4845533 (1989-07-01), Pryor et al.
patent: 4847674 (1989-07-01), Sliwa et al.
patent: 4853785 (1989-08-01), Ovshinsky et al.
patent: 4891330 (1990-01-01), Guha et al.
patent: 5128099 (1992-07-01), Strand et al.
patent: 5159661 (1992-10-01), Ovshinsky et al.
patent: 5166758 (1992-11-01), Ovshinsky et al.
patent: 5177567 (1993-01-01), Klersy et al.
patent: 5219788 (1993-06-01), Abernathey et al.
patent: 5238862 (1993-08-01), Blalock et al.
patent: 5272359 (1993-12-01), Nagasubramanian et al.
patent: 5296716 (1994-03-01), Ovshinsky et al.
patent: 5314772 (1994-05-01), Kozicki
patent: 5315131 (1994-05-01), Kishimoto et al.
patent: 5335219 (1994-08-01), Ovshinsky et al.
patent: 5341328 (1994-08-01), Ovshinsky et al.
patent: 5350484 (1994-09-01), Gardner et al.
patent: 5359205 (1994-10-01), Ovshinsky
patent: 5360981 (1994-11-01), Owen et al.
patent: 5406509 (1995-04-01), Ovshinsky et al.
patent: 5414271 (1995-05-01), Ovshinsky et al.
patent: 5500532 (1996-03-01), Kozicki et al.
patent: 5512328 (1996-04-01), Yoshimura et al.
patent: 5512773 (1996-04-01), Wolf et al.
patent: 5534711 (1996-07-01), Ovshinsky et al.
patent: 5534712 (1996-07-01), Ovshinsky et al.
patent: 5536947 (1996-07-01), Klersy et al.
patent: 5543737 (1996-08-01), Ovshinsky
patent: 5591501 (1997-01-01), Ovshinsky et al.
patent: 5596522 (1997-01-01), Ovshinsky et al.
patent: 5687112 (1997-11-01), Ovshinsky
patent: 5694054 (1997-12-01), Ovshinsky et al.
patent: 5714768 (1998-02-01), Ovshinsky et al.
patent: 5726083 (1998-03-01), Takaishi
patent: 5751012 (1998-05-01), Wolstenholme et al.
patent: 5761115 (1998-06-01), Kozicki et al.
patent: 5789277 (1998-08-01), Zahorik et al.
patent: 5814527 (1998-09-01), Wolstenholme et al.
patent: 5818749 (1998-10-01), Harshfield
patent: 5825046 (1998-10-01), Czubatyj et al.
patent: 5837564 (1998-11-01), Sandhu et al.
patent: 5841150 (1998-11-01), Gonzalez et al.
patent: 5846889 (1998-12-01), Harbison et al.
patent: 5851882 (1998-12-01), Harshfield
patent: 5869843 (1999-02-01), Harshfield
patent: 5896312 (1999-04-01), Kozicki et al.
patent: 5912839 (1999-06-01), Ovshinsky et al.
patent: 5914893 (1999-06-01), Kozicki et al.
patent: 5920788 (1999-07-01), Reinberg
patent: 5933365 (1999-08-01), Klersy et al.
patent: 5998066 (1999-12-01), Block et al.
patent: 6011757 (2000-01-01), Ovshinsky
patent: 6031287 (2000-02-01), Harshfield
patent: 6072716 (2000-06-01), Jacobson et al.
patent: 6077729 (2000-06-01), Harshfield
patent: 6084796 (2000-07-01), Kozicki et al.
patent: 6087674 (2000-07-01), Ovshinsky et al.
patent: 6117720 (2000-09-01), Harshfield
patent: 6141241 (2000-10-01), Ovshinsky et al.
patent: 6143604 (2000-11-01), Chiang et al.
patent: 6177338 (2001-01-01), Liaw et al.
patent: 6184477 (2001-02-01), Tanahashi
patent: 6236059 (2001-05-01), Wolstenholme et al.
patent: RE37259 (2001-07-01), Ovshinsky
patent: 6297170 (2001-10-01), Gabriel et al.
patent: 6300684 (2001-10-01), Gonzalez et al.
patent: 6316784 (2001-11-01), Zahorik et al.
patent: 6329606 (2001-12-01), Freyman et al.
patent: 6339544 (2002-01-01), Chiang et al.
patent: 6348365 (2002-02-01), Moore et al.
patent: 6350679 (2002-02-01), McDaniel et al.
patent: 6376284 (2002-04-01), Gonzalez et al.
patent: 6388324 (2002-05-01), Kozicki
patent: 6391688 (2002-05-01), Gonzalez et al.
patent: 6404665 (2002-06-01), Lowery et al.
patent: 6414376 (2002-07-01), Thakur et al.
patent: 6418049 (2002-07-01), Kozicki et al.
patent: 6420725 (2002-07-01), Harshfield
patent: 6423628 (2002-07-01), Li et al.
patent: 6429064 (2002-08-01), Wicker
patent: 6437383 (2002-08-01), Xu
patent: 6440837 (2002-08-01), Harshfield
patent: 6462984 (2002-10-01), Xu et al.
patent: 6469364 (2002-10-01), Kozicki
patent: 6473332 (2002-10-01), Ignatiev et al.
patent: 6480438 (2002-11-01), Park
patent: 6487106 (2002-11-01), Kozicki
patent: 6487113 (2002-11-01), Park et al.
patent: 6501111 (2002-12-01), Lowery
patent: 6507061 (2003-01-01), Hudgens et al.
patent: 6511862 (2003-01-01), Hudgens et al.
patent: 6511867 (2003-01-01), Lowery et al.
patent: 6512241 (2003-01-01), Lai
patent: 6514805 (2003-02-01), Xu et al.
patent: 6531373 (2003-03-01), Gill et al.
patent: 6534781 (2003-03-01), Dennison
patent: 6545287 (2003-04-01), Chiang
patent: 6545907 (2003-04-01), Lowery et al.
patent: 6555860 (2003-04-01), Lowery et al.
patent: 6563164 (2003-05-01), Lowery et al.
patent: 6566700 (2003-05-01), Xu
patent: 6567293 (2003-05-01), Lowery et al.
patent: 6569705 (2003-05-01), Chiang et al.
patent: 6570784 (2003-05-01), Lowery
patent: 6576921 (2003-06-01), Lowery
patent: 6586761 (2003-07-01), Lowery
patent: 6589714 (2003-07-01), Maimon et al.
patent: 6590807 (2003-07-01), Lowery
patent: 6593176 (2003-07-01), Dennison
patent: 6597009 (2003-07-01), Wicker
patent: 6605527 (2003-08-01), Dennison et al.
patent: 6613604 (2003-09-01), Maimon et al.
patent: 6621095 (2003-09-01), Chiang et al.
patent: 6625054 (2003-09-01), Lowery et al.
patent: 6642102 (2003-11-01), Xu
patent: 6646297 (2003-11-01), Dennison
patent: 6649928 (2003-11-01), Dennison
patent: 6667900 (2003-12-01), Lowery et al.
patent: 6671710 (2003-12-01), Ovshinsky et al.
patent: 6673648 (2004-01-01), Lowery
patent: 6673700 (2004-01-01), Dennison et al.
patent: 6674115 (2004-01-01), Hudgens et al.
patent: 6687153 (2004-02-01), Lowery
patent: 6687427 (2004-02-01), Ramalingam et al.
patent: 6690026 (2004-02-01), Peterson
patent: 6696355 (2004-02-01), Dennison
patent: 6707712 (2004-03-01), Lowery
patent: 6714954 (2004-03-01), Ovshinsky et al.
patent: 2001/0002046 (2001-05-01),
Brooks Joseph F.
Moore John T.
Dickstein & Shapiro LLP
Fourson George
Pham Thanh V.
LandOfFree
Method of forming electrode structure for use in an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming electrode structure for use in an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming electrode structure for use in an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3677056