Chemical mechanical planarization system with replaceable...

Details Chemical mechanical planarization system with replaceable... Chemical mechanical planarization system with replaceable...

2006-02-07

2006-02-07

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S057000

Reexamination Certificate

active

06994609

ABSTRACT:
A table assembly for use in a wafer preparation module is provided. The table assembly includes a replaceable pad assembly and a permanent pad assembly. The replaceable pad assembly has a removable support element and a pad. A backside of the pad is secured to a front surface of the removable support element. The permanent support element is removeably secured to the replaceable pad assembly. A method for conducting multiple wafer preparation operations in a single processing module, a method for conducting multiple CMP operations in a single module, and a system for preparing a wafer are also provided.

REFERENCES:
patent: 5676590 (1997-10-01), Hiraoka
patent: 6086464 (2000-07-01), Ulfig et al.
patent: 6379221 (2002-04-01), Kennedy et al.
patent: 6520895 (2003-02-01), Senga et al.
patent: 2003/0114079 (2003-06-01), Berkstresser et al.

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