Positive photoresist composition with a polymer including a...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S905000, C430S907000, C430S910000, C430S326000

Reexamination Certificate

active

07063931

ABSTRACT:
A positive photoresist composition comprises a radiations sensitive acid generator, and a polymer that may include a first repeating unit derived from a sulfonamide monomer including a fluorosulfonamide functionality, and a second repeating unit, which may include a pendant acid-labile moiety. The positive photoresist composition may also comprise at least one of a solvent, a quencher, and a surfactant. A patterned photoresist layer, made of the positive photoresist composition, may be formed on a substrate, the positive photoresist layer may be exposed to a pattern of imaging radiation, a portion of the positive photoresist layer that is exposed to the pattern of imaging radiation may be removed to reveal a correspondingly patterned substrate for subsequent processing in the manufacture of a semiconductor device.

REFERENCES:
patent: 6165678 (2000-12-01), Allen et al.
patent: 6177228 (2001-01-01), Allen et al.
patent: 6235849 (2001-05-01), Jayaraman et al.
patent: 6420503 (2002-07-01), Jayaraman et al.
patent: 6706826 (2004-03-01), Fujiwara et al.
patent: 6824956 (2004-11-01), Sato

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