Semiconductor device, method for manufacturing the same,...

Details Semiconductor device, method for manufacturing the same,... Semiconductor device, method for manufacturing the same,...

2006-08-29

2006-08-29

Pham, Thanhha (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S623000, C438S678000

Reexamination Certificate

active

07098127

ABSTRACT:
A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A method for manufacturing the semiconductor device includes a step of applying a layer of the resin to the semiconductor device except for the electrodes, a step of patterning the conductive layers on the electrodes and the layer of the resin in accordance with the protrusions, and a step of removing the layer of the resin located between the conductive layers by the use of the patterned conductive layers as masks so as to form the protrusions.

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Communication from Chinese Patent Office regarding related application.

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