Displacing edge segments on a fabrication layout based on...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000

Reexamination Certificate

active

07131101

ABSTRACT:
Techniques for forming a mask fabrication layout for a physical integrated circuit design layout include correcting the fabrication layout for proximity effects using a proximity effects model. A proximity effects model is executed to produce an initial output. The initial output is based on a first position for a segment in a fabrication layout. The first position is displaced from a corresponding original edge in the original fabrication layout by a distance equal to an initial bias. The model is also executed to produce a second output based on a second position for the segment. The second position is displaced from the corresponding original edge by a distance equal to a second bias. An optimal bias for the segment is determined based on the initial output and the second output. The segment is displaced in the fabrication layout from the corresponding edge based on the optimal bias.

REFERENCES:
patent: 4231811 (1980-11-01), Somekh et al.
patent: 4426584 (1984-01-01), Bohlen et al.
patent: 4456371 (1984-06-01), Lin
patent: 4895780 (1990-01-01), Nissan-Cohen et al.
patent: 4902899 (1990-02-01), Lin et al.
patent: 5208124 (1993-05-01), Sporon-Fiedler et al.
patent: 5498579 (1996-03-01), Borodovsky et al.
patent: 5553274 (1996-09-01), Liebmann
patent: 5636002 (1997-06-01), Garofalo
patent: 5663017 (1997-09-01), Schinella et al.
patent: 5663893 (1997-09-01), Wampler et al.
patent: 5682323 (1997-10-01), Pasch et al.
patent: 5723233 (1998-03-01), Garza et al.
patent: 5766806 (1998-06-01), Spence
patent: 5792581 (1998-08-01), Ohnuma
patent: 5821014 (1998-10-01), Chen et al.
patent: 5862058 (1999-01-01), Samuels et al.
patent: 5879844 (1999-03-01), Yamamoto et al.
patent: 5885734 (1999-03-01), Pierrat et al.
patent: 5885748 (1999-03-01), Ohnuma
patent: 5900338 (1999-05-01), Garza et al.
patent: 5958635 (1999-09-01), Reich et al.
patent: 5972541 (1999-10-01), Sugasawara et al.
patent: 5991006 (1999-11-01), Tsudaka
patent: 5994002 (1999-11-01), Matsuoka
patent: 6004702 (1999-12-01), Lin
patent: 6007310 (1999-12-01), Jacobsen et al.
patent: 6014456 (2000-01-01), Tsudaka
patent: 6042257 (2000-03-01), Tsudaka
patent: 6058203 (2000-05-01), Tsudaka
patent: 6067375 (2000-05-01), Tsudaka
patent: 6077310 (2000-06-01), Yamamoto et al.
patent: 6078738 (2000-06-01), Garza et al.
patent: 6114071 (2000-09-01), Chen et al.
patent: 6145118 (2000-11-01), Tomita
patent: 6154563 (2000-11-01), Tsudaka
patent: 6243855 (2001-06-01), Kobayashi et al.
patent: 6249597 (2001-06-01), Tsudaka
patent: 6289499 (2001-09-01), Rieger et al.
patent: 6298473 (2001-10-01), Ono et al.
patent: 6370441 (2002-04-01), Ohnuma
patent: 6416907 (2002-07-01), Winder et al.
patent: 6453457 (2002-09-01), Pierrat et al.
patent: 6523162 (2003-02-01), Agrawal et al.
patent: 6610989 (2003-08-01), Takahashi
patent: 6961920 (2005-11-01), Zach
patent: 2002/0100004 (2002-07-01), Pierrat et al.
patent: 2324169 (1998-10-01), None
patent: 3-80525 (1991-04-01), None
patent: 3-210560 (1991-09-01), None
patent: 8-236317 (1996-09-01), None
patent: 10-133356 (1998-05-01), None
patent: 11-143085 (1999-05-01), None
patent: WO 99/47981 (1999-09-01), None
patent: WO 00/67074 (2000-11-01), None
patent: WO 00/67075 (2000-11-01), None
patent: WO 00/67076 (2000-11-01), None
Barouch, E., et al., “OPTIMASK: An OPC Algorithm for Chrome and Phase-Shift Mask Design”, SPIE, Vo. 2440, pp. 192-206, Feb. 1995.
Brunner, T., et al., “Approximate Models for Resist Processing Effects”, SPIE, vol. 2726, pp. 198-207, Mar. 1996.
Brunner, T., “Rim Phase-Shift Mask Combined with Off-Axis Iliumination: A Path to 0.5(lampda)/ Numerical Aperture Geometrics”, Optical Engineering, vol. 32, No. 10, pp. 2337-2343, Oct. 1993.
Casey, Jr., J.D., et al., “Chemically Enhanced FIB Repair of Opaque Defects on Molybdenum Silicide Photomasks”, SPIE, vol. 3236, pp. 487-497 (1997).
Chang, K., et al., “Accurate Modeling of Deep Submicron Interconnect Technology”, TMA Times, vol. IX, No. 3 (1997).
Gans, F., et al., “Printability and Repair Techniques for DUV Photomasks”, SPIE, Proceedings Of The 17th Annual Symposium On Photomask Technology And Management, vol. 3236, pp. 136-141 (1997).
Ham, Y.M., et al., “Dependence of Defects in Optical Lithography”, Jpn. J. Appl. Phys., vol. 31, pp. 4137-4142 (1992).
Henke, W., et al., “A Study of Reticle Defects Imaged Into Three-Dimensional Developed Profiles of Positive Photoresist Using the Solid Lithography Simulator”, Microelectronics Eng., vol. 14, pp. 283-297 (1991).
Ibsen, K., et al., “Clear Field Reticle Defect Diposition for Advanced Sub-Half Micron Lithography”, SPIE, Proceedings Of The 17th Annual Symposium On Photomask Technology And Management, vol. 3236, pp. 124-135 (1997).
Ishiwata, N., et al., “Novel Alternating Phase Shift Mask with Improved Phase Accuracy”, SPIE, Proceedings Of The 17th Annual Symposium On Photomask Technology And Management, vol. 3236, pp. 243-249 (1997).
Jinbo, H., et al., “0.2um or Less i-Line Lithography by Phase-Shifting-Mask Technology”, IEEE, pp. 33.3.1-33.3.4 (1990).
Jinbo, H., et al., “Application of Blind Method to Phase-Shifting Lithography”, IEEE, 1992 Symposium On VLSI Technology Digest Of Technical Papers, pp. 112-113 (1992).
Jinbo, H., et al., “Improvement of Phase-Shifter Edge Line Mask Method”, Japanese Journal Of Applied Physics, vol. 30, No. 11B, pp. 2998-3003, Nov. 1991.
Karklin, L., “A Comprehensive Simulation Study of the Photomask Defects Printability”, SPIE, vol. 2621, pp. 490-504 (1995).
Kimura, T., et al., “Subhalf-Micron Gate GaAs Mesfet Process Using Phase-Shifting-Mask Technology”, IEEE, GaAs IC Symposium, pp. 281-284 (1991).
Lithas, “Lithas: Optical Proximity Correction Software” (2 pages), date not available.
Microunity, “OPC Technology & Product Description”, MicroUnity Systems Engineering, Inc., pp. 1-5.
Morimoto, H., et al., “Next Generation Mask Strategy—Technologies are Ready for Mass Production of 256MDRAM?”, SPIE, vol. 3236, pp. 188-189 (1997).
Nistler, J., et al., “Large Area Optical Design Rule Checker for Logic PSM Application”, SPIE, Photomask And X-Ray Mask Technology, vol. 2254, pp. 78-92 (1994).
Nistler, J., et al., “Phase Shift Mask Defect Printability Analysis”, Proceedings Of The Microlithography Seminar INTERFACE '93, OCG Microelectronic Materials, Inc., pp. 11-28 (1993).
Ohtsuka, H., et al., “Phase Defect Repair Method for Alternating Phase Shift Masks Conjugate Twin-Shifter Method”, Jpn. J. Appl. Phys., vol. 31, pp. 4143-4149 (1992).
Park, C., et al., “An Automatic Gate CD Control for a Full Chip Scale SRAM Device”, SPIE, vol. 3236, pp. 350-357 (1997).
Pati, Y.C., et al., “Exploiting Structure in Fast Aerial Image Computation for Integrated Circuit Patterns”, IEEE Transactions On Semiconductor Manufacturing, vol. 10, No. 1, pp. 62-74, Feb. 1997.
Pati, Y.C., et al., “Phase-Shifting Masks for Microlithography: Automated Design and Mask Requirements”, J. Opt. Soc. Am., vol. 11, No. 9, pp. 2438-2452, Sep. 1994.
Precim, “Proxima System”, Precim Company, Portland, Oregon (2 pages), date not available.
Precim, “Proxima Wafer Proximity Correction System”, Precim Company, Portland, Oregon (2 pages), date not available.
Rieger, M., et al., “Customizing Proximity Correction for Process-Specific Objectives”, SPIE, vol. 2726, pp. 651-659 (1996).
Rieger, M., et al., “Mask Fabrication Rules for Proximity-Corrected Patterns”, Precim Company, Portland, Oregon (10 pages), date not available.
Rieger, M., et al., “System for Lithography Proximity Compensation”, Precim Company, Portland, Oregon, Sep. 1993 (28 pages).
Rieger, M., et al., “Using Behavior Modeling for Proximity Correction”, Precim Company, Portland, Oregon (6 pages), date not available.
Roman, B., et

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