Encapsulating brittle substrates using transfer molding

Details Encapsulating brittle substrates using transfer molding Encapsulating brittle substrates using transfer molding

2006-10-03

2006-10-03

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

C425S129100

Reexamination Certificate

active

07114939

ABSTRACT:
A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

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