4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Huck Khim Koay

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Encapsulating brittle substrates using transfer molding

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate

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Light source

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Method of interconnecting an electronic device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2096629

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