Bumping process to increase bump height

Details Bumping process to increase bump height Bumping process to increase bump height

2006-12-05

2006-12-05

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S614000, C438S687000

Reexamination Certificate

active

07144801

ABSTRACT:
A bumping process mainly comprises the steps of providing a wafer having a plurality of bonding pads, forming a patterned adhesive layer over the bonding pads, forming a barrier layer and a wetting layer on the patterned adhesive layer and the surface of the wafer, removing the barrier layer and the wetting layer not covering the patterned adhesive layer, forming a plurality of bumps on the patterned wetting layer and reflowing the bumps.

REFERENCES:
patent: 6232212 (2001-05-01), Degani et al.
patent: 6664128 (2003-12-01), Tong et al.
patent: 6853076 (2005-02-01), Datta et al.
patent: 6897141 (2005-05-01), Kim

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