Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-11-14
2006-11-14
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S840000, C029S841000, C029S860000, C148S283000, C228S209000, C228S220000, C428S469000
Reexamination Certificate
active
07134199
ABSTRACT:
A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.
REFERENCES:
patent: 5615477 (1997-04-01), Sweitzer
patent: 6180253 (2001-01-01), Mori et al.
Chen Li-Chih
Chen Yen-Ming
Ching Kai-Ming
Jian Yue-Ying
Kuo Wen-Chang
Phan Tim
Taiwan Semiconductor Manufacturing Co. Ltd.
Tugbang A. Dexter
Tung & Associates
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