Semiconductor device fabricating apparatus and semiconductor...

Details Semiconductor device fabricating apparatus and semiconductor... Semiconductor device fabricating apparatus and semiconductor...

2006-06-20

2006-06-20

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S671000, C438S686000, C438S666000, C438S652000, C438S113000, C438S127000, C438S460000

Reexamination Certificate

active

07064011

ABSTRACT:
A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads20on an adhesive layer included in an adhesive sheet50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet50with surfaces thereof not provided with any electrodes in contact with the adhesive sheet50, and electrically connecting electrodes11formed on the semiconductor chips10and upper parts of the conductive pads20with wires30. The semiconductor chips10, the wires30and the conductive pads20are sealed in a sealing resin molding40, and then the adhesive sheet50is separated from the sealing resin molding40. Each of the conductive pads20has a reduced part20b, and a jutting part20ajutting out from the reduced part20b. The conductive pads20having such construction can be firmly bonded to the sealing resin molding40.

REFERENCES:
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6534330 (2003-03-01), Sakamoto et al.
patent: 6562660 (2003-05-01), Sakamoto et al.
patent: 6969905 (2005-11-01), Paulus
patent: 2001/0015489 (2001-08-01), Fujisawa et al.
patent: 2002/0197771 (2002-12-01), Dotta et al.
patent: 2004/0253764 (2004-12-01), Kang et al.
patent: 09-252014 (1997-09-01), None
patent: 2001-210743 (2001-08-01), None

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