CMP method and device capable of avoiding slurry residues

Details CMP method and device capable of avoiding slurry residues CMP method and device capable of avoiding slurry residues

2006-02-28

2006-02-28

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S054000

Reexamination Certificate

active

07004820

ABSTRACT:
A method for chemical mechanical polishing (CMP) includes a rinsing process performed to clean an orifice of a slurry supplier and other elements of a CMP device. The CMP device includes least one nozzle disposed in the periphery of a base. The function of the nozzle is to spray DI water to the orifice of the slurry supplier so as to prevent slurry residue and clogging.

REFERENCES:
patent: 5861066 (1999-01-01), Moinpour et al.
patent: 6206760 (2001-03-01), Chang et al.
patent: 6319105 (2001-11-01), Togawa et al.
patent: 2002/0063169 (2002-05-01), Verhaverbeke et al.
patent: 2002/0187731 (2002-12-01), Chen et al.
patent: 2004/0132318 (2004-07-01), Kim et al.

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