Semiconductor device, semiconductor package member, and...

Details Semiconductor device, semiconductor package member, and... Semiconductor device, semiconductor package member, and...

2006-08-22

2006-08-22

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S738000, C257S777000

Reexamination Certificate

active

07095112

ABSTRACT:
Provided a semiconductor device including: a wiring board; a semiconductor chip having a pad electrically connected to a wiring on the wiring board; a second semiconductor chip provided on the wiring board at a position facing a side of the semiconductor chip, having passive elements integrated therein, and having pads for external connection to which both ends of the passive elements are connected respectively and at least one of which is electrically connected to the wiring on the wiring board electrically connected to the pad of the semiconductor chip.

REFERENCES:
patent: 4670770 (1987-06-01), Tai
patent: 4945399 (1990-07-01), Brown et al.
patent: 6166937 (2000-12-01), Yamamura et al.
patent: 6362525 (2002-03-01), Rahim
patent: 2003/0146463 (2003-08-01), Klee et al.
patent: 2004/0238934 (2004-12-01), Warner et al.
patent: 2002-110865 (2002-04-01), None
patent: 2003-007971 (2003-01-01), None

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