Radiation-sensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S281100, C430S288100, C430S325000

Reexamination Certificate

active

07141355

ABSTRACT:
A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein:the alkali-soluble resin having an unsaturated group (A) is obtained by reacting:100 parts by weight of a copolymer comprising1 to 40 wt % structural units derived from (a) a radically polymerizable compound having a carboxyl group;1 to 50 wt % structural units having a phenolic hydroxyl group which are derived from (b-1) a radically polymerizable compound having a phenolic hydroxyl group or (b-2) a radically polymerizable compound having a functional group convertible into a phenolic hydroxyl group after the copolymerization,other structural units of said copolymer being derived from (c) another radically polymerizable compound;with 0.1 to 20 parts by weight of (d) a radically polymerizable compound having an epoxy group.The resin composition can form a radiation-sensitive film in a thickness greater than a deposit thickness and has a high resolution.

REFERENCES:
patent: 5260161 (1993-11-01), Matsumura et al.
patent: 6010826 (2000-01-01), Abe et al.
patent: 6475701 (2002-11-01), Ohno et al.
patent: 2001/0044075 (2001-11-01), Nishimura et al.
patent: 2000-39709 (2000-02-01), None
patent: 2001-228606 (2001-08-01), None
patent: 2002-14466 (2002-01-01), None

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