Method for handling integrated circuit die

Details Method for handling integrated circuit die Method for handling integrated circuit die

2006-06-13

2006-06-13

Nguyen, George (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S739000, C029S740000, C029S743000, C029S759000, C029S760000, C029SDIG044, C294S064200, C324S765010

Reexamination Certificate

active

07059045

ABSTRACT:
In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.

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patent: 5722159 (1998-03-01), Stratas
patent: 5739050 (1998-04-01), Farnworth
patent: 6407006 (2002-06-01), Levert et al.
patent: 6504723 (2003-01-01), Fitzgerald et al.
patent: 6629363 (2003-10-01), Chan
patent: 05040149 (1993-02-01), None
Online Dictionary “www.encarta.com” for Definition of “Plastic”.

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