Process tape for cleaning or processing the edge of a...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S303000, C451S307000, C451S005000

Reexamination Certificate

active

07115023

ABSTRACT:
A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second process rollers are positioned to cause the process tape to contact an edge of the wafer when the wafer is loaded into the processing apparatus. The process tape is configured to frictionally prepare the edge where contact occurs with the process tape.

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