Method to assemble structures from nano-materials

Details Method to assemble structures from nano-materials Method to assemble structures from nano-materials

2006-10-17

2006-10-17

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C977S788000

Reexamination Certificate

active

07122461

ABSTRACT:
Numerous embodiments of a method to assemble nano-materials on a platform are described. In one embodiment, a nano-material is functionalized with a first bondable group. The functionalized nano-material is disposed on an assembly platform having an electrode to form a first layer. Additional layers of the nano-material may be formed above the first layer to form a semiconductor device. In one embodiment, the nano-material may be a carbon nanotube.

REFERENCES:
patent: 2005/0045867 (2005-03-01), Ozkan et al.
patent: 2005/0056828 (2005-03-01), Wada et al.
patent: 2005/0136483 (2005-06-01), Carlson
patent: 2005/0164432 (2005-07-01), Lieber et al.

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